Lead 3D

Jobid=) pExciting technologies with leadership opportunity! /ppMy client is looking for an Advanced Packaging Engineer to lead the 3D architecture for quantum applications, based in the Netherlands. /ppJob responsibilities: /pulliLead RD for entire cycle - with direct contribution to new packaging and assembly techniques /liliInnovate and develop advanced packaging techniques /liliCommunicate and partner with external vendors and clients /li /ulYou will have:ulliMasters/PhD in Physics or related field /liliBackground in semiconductor packaging /liliExperience with advanced packaging techniques /liliLeadership background and comfortable communicating with stakeholders /li /ulNice to have:ulliPackaging tools knowledge e.g. thermal/mechanical techniques /liliBackground in hardware RD /liliCollaborative and excellent communication skills. /li /ulp7710 N FM 620,Bldg. 13-d, Austin.Texas 78726 /p #J-18808-Ljbffr https://vacatureforum.nl/@delft